ETCHING

The modular designed etching and developing devices of Lemmen Ltd., allow for fast processing of printed circuit boards in the spray-etching and development process, foam-etching process or continuous spray-etching process. This provides the perfect premise for a high-quality printed circuit board image.

Special holders allow the customer to edit different PCB materials in the manual or vertical method of process running. The floor-mounted or table units in a compact construction include all process steps from developing, etching and rinsing (optional stripping) in one unit and enable the production of highquality PCB structures of 50-100 microns. The units are designed for prototypes and small series
of up to a suitable plate size of 500 x 600 mm

The spray development and spray etching units, ETCHING CENTER S and CONVERT from WALTER Lemmen Ltd., are suitable for the production of fineline single or double-sided printed circuit boards or chemical milled parts. The systems are available either manually or vertically, which are operating systems with integrated rinsing modules. Our new rotation spray systems give uniformity and intensive treatment to the entire surface. The units are equipped with multiple rinses which is characterized by their clean and compact way of working. The modular design allows expansion of the units by a stripper and dryer module.