FINETECH (GERMANY) / Micro Assembly / FINETECH

Products Name: FINEPLACER® pico ma

Products Details: The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.
Highlights*
-Placement accuracy 5 µm
-Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm
-Working area up to 450 mm x 234 mm
-Supports wafer/substrate sizes up to 8"
-Supports bonding forces up to 700 N
-Can be configured as a hot air rework system
-Manual and semi-automatic configurations

For more information please visit http://eu.finetech.de
 

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