FINETECH (GERMANY) / Micro Assembly / FINETECH

Products Name: FINEPLACER® femto

Products Details: The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced flip chip and die bonding applications.
Highlights*

-Sub-micron placement accuracy
-Handles ultra small to very large components F
-ully-automated operation and assembly process
-Supports wafer/substrate sizes up to 12"
-Supports bonding forces up to 500 N
-Economically flexible platform architecture
-Small footprint and compact design
-Long-term stability and support

For more information please visit http://eu.finetech.de
 

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