The SB²-M is the smallest available equipment in the SB²-series with a maximum working area of 4”. It is a semiautomatic solder ball placement reflow/rework machine designed for small volume manufacturing, prototyping and research & development.

- Solder Jetting
- SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi
- Flux-free reflow with laser
- Solder ball diameter 100 – 760µm
- Ball rework & (de-balling & re-balling) capability