Extraction of residual Solder
The SMART DESOLDER combines a manual hot gas source with a vacuum pen for extraction. Damage to the pads from overheating or mechanical stress is avoided through targeted heating of the residual solder after lifting the component. The temperature-controlled airflow prevents the neighboring components from warming up.
After melting, the residual solder is removed gently by the vacuum pen. The use of a Teflon tip in the vacuum pen offers outstanding features: the nonstick effect, the temperature-resistance and the mechanically soft surface of the material.
Even small and less complex soldering works can be done with the SMART DESOLDER 01.